Milwaukee 6184-01 Operations Instructions download pdf (Page 58)

Some

parts are

manufactured

or

selected

by

Tektronix,

Inc

.

t

o

satisfy

particular

requirements,

or

are

manufactured

to

specifications

for

Tektronix, Inc

.

Most

of

the

mechanical

parts

used

in

this

instrument

have

been

manufactured

by

Tektronix,

Inc

.

To

determine

the

manufacturer

of

parts,

first

refer

to

parts

list,

then

to

the

Cross

Index---Mfr

.

Code

Number

to

Manufacturer

.

When

ordering

replacement

parts

from

Tektronix, Inc

.,

include

the

following

information

:

1

.

Instrument

type

.

2

.

Instrument

serial

number

.

3

.

A

description

of

the

part

(if

electrical,

include

circuit

number)

.

4

.

Tektronix

part

number

.

SOLDERING

TECHNIQUES

To

avoid

electrical

shock,

disconnect

the

instrument

from

the

power

source

before

soldering

.

The

reliability

and

accuracy

of

this

instrument

can

be

maintained

only

if

proper

soldering

techniques

are

used

when

repairing or

replacing

parts

.

General

soldering

techniques,

which

apply

to

maintenance

of

any

precision

electronic

equipment,

shouldbe

used

when

working

on

this

instrument

.

Use

only

60/40

rosin-core,

electronic-

grade

solder

.

The

choice

of

soldering

iron

is

determined

by

the

repair

to

be

made

.

When

soldering

on

circuit

boards,

use

a

15-

to

40-watt

pencil-type soldering

iron

with

a

1/8-inch

wide,

wedge-shaped

tip

.

A

higher

wattage

soldering

iron

may

separate

the

printed

wiring

from

its

base

material

.

Keep

the

tip

properly

tinned

for

best

heat

transfer

to

the

solder

joint

.

Avoid

excessive

heat

;

apply

only

enough

heat

to

remove

the

component

or to

make

a

good

solder

joint

.

Also,

apply

only

enough

solder to

make

a

firm

solder

joint

;

do

not

apply

too

much

solder

.

All

circuit

boards,

except

the

readout

circuit

board,

in

this

instrument

are

multilayer

type

boards

with

a

conductive

path(s)

laminated

between

the

top

and

bottomboard

layers

.

All

soldering

on

these

boards

should

be

done

with

extreme

care

to

prevent

breaking

the

connections

to

the

center

conductor(s),

only

experienced

maintenance

personnelshould

attempt

repair

of

these

boards

.

Maintenance--7B87

For

metal

terminals

(e

.g

.,

switch

terminals,

potentiometers,

etc

.)

a

higher wattage-rating

soldering

iron

may

be

required

.

Match

the

soldering

iron

to

the

work

being

done

.

For

example,

if

the

component

is

connected

to

the

chassis

or

other

large

heat-radiating

surface,

it

will

require

a

75-watt

or

larger

soldering

iron

.

The

following

techniques

should be

used

to

replace

a

component

on

a

circuit

board

:

1

.

Grip

the

component

lead

with

long-nose

pliers

.

Touch

the

soldering

iron

to

the

lead

at

the

solder

connection

.

Do

not

lay

the

iron directly

on

the

board,

as

it

may

damage

the

board

.

2

.

When

the

solder

begins

to

melt,

gently

pull

the

lead

out

.

If

unable

to

pull

out

the

lead

without

using

force,

try

removing

the

other

end

of

the

component

as

it

may

be

more

easily

removed

.

NOTE

The reason

some

component

leads

are

troublesome

to

remove

is

due

to

a

bend

placed

on

each

leadduring

the

manufacturing

process

.

The

bent

leads

hold

components

in

place

during

a

process

that

solders

many

components

at

one

time

.

If

a

component

lead

is

extremely

difficult

to

remove,

it

may

be

helpful to

straighten

the

leads

on

the

back

side

of

the

board

with

a

small

screwdriver

or

pliers

while

heating

the

soldered

connection

.

Use

only

enough

heat

to

remove

the

component

lead

without

removing

the

solder

from

the

board

.

If it

is

desired

to

remove

solder

from

a circuit-board hole

for

easier

installation

of

a

new

component,

a solder-

removing

wick

should be

used

.

3

.

Bend

the

leads

of

the

new

component

to

fit

the

holes

in

the

board

.

If

the

component

is

replaced

while

the

board

is

mounted

in

the

instrument,

cut

the

leads

sothey

will

just

protrude

through

the

board

.

Insert

the leads

into

the

holes

so

the

component

is

firmly

seated

against

the

board

(or

as

positioned

originally)

.

If it

does

not

seat

properly,

heat

the

solder

and

gently

press

the

component

into

place

.

4

.

Touch

the

iron

to

the

connection

and

apply

a

small

amount

of

solder

to

make

a firm

solder-joint

.

To

protect

heat-sensitive

components,

hold

the

lead

between

the

component

body

and

the

solder

joint

with

a

pair

of

long-

nose

pliers

or

other

heat

sink

.

5

.

Clip

any

excess

lead

protruding

through

the

board

(if

not

clipped

in

step

3)

.

6

.

Clean

the

area

around

the

solder

connection

with

a

flux-removing

solvent

.

Be

careful

not

to

remove

information

printed

on

the

board

.

4-

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